DiBcom raises €24.5M round led by Partech International and welcomes 5 new international investors to extend mobile TV leadership.

DiBcom, a fabless semiconductor company specializing in chipsets for mobile TV, is pleased to announce the closing of its fourth round of financing for a total amount of € 24.5 million; the largest venture-backed financing for a French IT company in 2005.

Five international investors have joined existing investors in the new capital round: Partech International which leads this round of investment, Intel Capital, 3i, WI Harper and UMC. This funding allows DiBcom to significantly expand its sales and marketing presence in Asia and the United States, as well as extend its mobile TV product roadmap. DiBcom was assisted by Clipperton Finance, an advisory firm specializing in High-Tech and Media.

DiBcom is at the heart of mobile TV. As a fabless semiconductor company that designs high-performance chipsets, DiBcom enables low-power mobile and portable TV reception everywhere and at speeds exceeding 150 mph. The company’s solutions are used in automotive, PC/peripheral and handheld device applications. DiBcom has extensive experience solving real-world mobile digital terrestrial television (DTT) reception problems and has overcome the main technological barriers to high-quality service. The company has developed patented algorithms and architecture for fast and accurate channel estimation and high Doppler compensation. Its chipsets are compliant with the current worldwide Digital Video Broadcast standards DVB-T and DVB-H. For more information, please visit www.dibcom.com.